HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance requirements. This thin dielectric at 0.0015" (38μm) has the ability to withstand high temperatures with a glass transition of 185°C and phenomenal thermal performance of 0.30°C/W (RD 2018). Bergquist Thermal Clad HPL is available in scored array circuits, scored singulated circuit, punched singulated parts and in LED standard stars and squares configurations.
Applications
- High watt-density applications where achieving the lowest
- thermal resistance is required
- Backlighting
- Projectors
- LED applications
Benefits
- Very low thermal impedance 0.02°C-in2/W (0.13°Ccm2/W)
- High thermal conductivity of 3.0 W/m-K
- High temperature applications
- Lead-free solder compatible
- RoHS compliant and environmentally green
- Available on all aluminum and copper metal substrates as
- well as Ultra Thin Circuits
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