Capacitance Breakthrough in Integrated Passive Devices

Expanding its product portfolio in high-density Integrated Passive Devices, IPDiA, a leading supplier of Silicon passive components, has today introduced a new generation of PICS technology, dubbed PICS3, which has recorded 250 nF/mm2 capacitance density for demanding applications including medical, aerospace, industrial, communication and defense.

“Delivery of Silicon capacitors with several µFarad capacitances is now a reality”, said Laurent Dubos, IPDiA marketing manager.

Thanks to its patented and leading PICS technology, IPDiA integrates up to hundred passive components (resistors, capacitors, inductors and diodes) in a single silicon die, as well as a single 10 µfarad capacitor offering an upgrade solution to tantalum or ceramic capacitors with the “out of standard performance” of the silicon passive component.

IPDiA produces standalone Integrated Passive Devices (IPD) or passive component networks that can be reflow or bumped, both on main electronic boards as well as in System in Package (SiP).

Comments

Post a Comment

Popular posts from this blog

Lenze 8400 Protec Tailored for Decentralized Applications and Integrated Positioning

Lenze Americas, a leading global manufacturer of electrical and mechanical drives, motion control and automation technology, announced today the release of the Plug and Drive 8400 protec frequency inverter drive for decentralized applications and those requiring integrated positioning. "For decentralized applications that require precision positioning, the 8400 protec frequency inverter is in the right place—mounted on the line or wall adjacent—ready to start, on the spot,” says Darrow Hanesian, Global Director of Inverter Products, Lenze Americas. The Lenze 8400 protec inverter ships ready to install with innovative Plug and Drive Technology, in addition to standard mains, motor, brake and communications connectors. All terminals of the 8400 protec, ranging from the shielded motor cable to the power supply and the fieldbus link, and including the terminal for the sensors, are equipped with standardized connectors to reduce installation time and increase plant availability a...
Read more

SMT Connector Powers LEDs From Underside Of Board

Tyco has introduced the SMT thru-board connector, which supplies power from the underside of an FR4 or aluminium-clad PC board, eliminating issues of dressing wires on the top side of LED boards. The two-position through six-position connector surface mounts on top of the board, passing through the board to present an underside interface. The connector mates with standard Mini CT connectors. The inverted design allows simpler assembly and installation of solid-state LED lighting in architectural, residential and commercial applications. The Mini CT connector is rated for three amps per contact, on 24 AWG wire. A space-saving low-profile design and rounded corners minimise shadowing. The connector fits through a hole or notch in the board. High-temperature materials allow the connector to be reflow soldered, while a flat-top surface provides compatibility with vacuum pickup. The connector uses surface-mount hold-downs to provide stability during mating and unmating. With UL listing...
Read more

Electromechanical Relays (EMRs) vs. Solid State Relays Comparison (SSRs)

Image
Electromechanical Relays (EMR) Pros (Advantages) Lower initial cost compared to solid state relays. Provides complete electrical isolation. Tolerates high current & voltage transients. Insensitive to electromagnetic interference (EMI) / radio frequency interference (RFI). Higher open resistance (air gap). Lower closed resistance. Available with many poles/circuits (up to 8 or more). Many different circuit configurations available. Multiple packaging & feature options. Most typical failure mode is open. Electromechanical Relays (EMR) Cons (Disadvantages) Higher control (coil) power consumption. Contact arcing can cause pitting & eventual open/short failure. Contacts can be affected by corrosion, oxidation or contamination. Contact bounce possible due to shock & vibration. Generates electromagnetic interference (EMI) / radio frequency interference (RFI). Can be orientation sensitive. Can be affected by external magnetic fields. Subject to mechanic...
Read more