Hi-Flow 565U and 565UT

Hi-Flow 565U is a thermally conductive phase change material which is applied in tabulated pad form. In the application the easy to use material undergoes a phase change at 52°C. After phase change, Hi-Flow 565U wets out the thermal interfaces resulting in a very low thermal impedance.

Hi-Flow 565U displaces easily at low pressures to provide a thermal performance comparable to the best thermal greases. Hi-Flow 565U is provided at a consistent thickness to ensure reliable performance. Hi-Flow 565U is attached to the target surface via pressure from a hard rubber roller or squeegee.

Typical Applications Include
  •     Processor lid to heat sink
  •     Processor die to lid or heat sink
  •     FBDIMM to heat spreader
Features and Benefits
  •     Thermal impedance: 0.04°C-in2/W (@25 psi)
  •     Very high thermal conductivity: 3.5 W/mK
  •     52°C phase change temperature
  •     Unsupported

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