Hi-Flow 330P
Hi-Flow 330P offers excellent handling and consistent liner peel-off characteristics. The material is designed for use between a high power electronic component requiring electrical isolation and its heat sink.
Bergquist recommends the use clips or springs for phase change materials to assure constant pressure between the component interface and the heat sink.
• Thermal impedance: 0.18°C-in2/W (@25 psi)
• Natural tack for ease of assembly
• Exceptional thermal performance in an insulated pad
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