Liqui-Bond SA 1800
Liqui-Bond SA 1800 features a combination of high thermal conductivity with a low viscosity which allows for ease of screen or stencil application. This material is also ideal for high volume automated pattern dispensing. Liqui-Bond SA 1800's low viscosity allows the material to achieve a very thin bond line, producing excellent thermal performance and a high shear strength.
Liqui-Bond SA 1800’s mild elastic properties assist in relieving CTE stresses during thermal cycling. The material cures at elevated temperatures and requires refrigeration storage at 10°C. Liqui-Bond SA 1800 is available with optional glass beads to provide a consistent stand-off and ensure dielectric integrity.
Typical Applications Include:
- PCB assembly to housing
- Discrete component to heat spreader
- High thermal conductivity: 1.8W/m-K
- Eliminates need for mechanical fasteners
- Low viscosity for ease of screening or stenciling
- Maintains structural bond in severe-environment applications
- Heat cure
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