Master Bond Polymer System EP65HT-1 represents a breakthrough in
epoxy adhesive technology in that it features the unusual combination of
ultra-fast cures and high temperature resistance. While typical fast
setting epoxies normally possess glass transition temperatures below
85°C, EP65HT-1 has an amazing Tg of over 125°C. In addition, unlike the
typical fast cure epoxies, EP65HT-1 retains fast setup times even when
mixed in relatively small masses. EP65HT-1 normally will setup in 3-5
minutes in 10 to 20 gram masses. Full cure normally occurs within a few
hours with exceptionally high tensile shear strengths approaching 3,000
psi. Service temperature range is 60°F to +400°F. EP65HT-1 offers
superior electrical insulating properties and a strong chemical
resistance profile. EP65HT-1 has now been qualified to meet NASA low
outgassing specifications.
EP65HT-1 bonds well to a wide variety of substrates including metals,
glass, ceramics, woods, vulcanized rubbers and many plastics.
Dispensing of the EP65HT-1 has been tremendously facilitated by the
development of a dispensing gun capable of mixing fast setting materials
with a 10 to 1 mix ratio. As a consequence, EP65HT-1 is becoming widely
used for both manufacturing and prototyping in the electrical,
electronic, appliance, computer, optical, automotive and OEM industries.
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