Custom Solutions for Advanced Sensing Applications

In a world driven by technology, scanning and sensing equipment must constantly evolve to meet new challenges. That's where Marktech can help. Advanced sensing applications require the correct custom solution either in packaged component or assembly form. Our engineers offer design expertise taken from 26 years of history specializing in sensor packaging covering UV and IR spectral ranges.

Marktech's engineering and production staff can combine the latest chip technology and packaging options turning customer prototypes within a few weeks. Our additional capabilities of wafer growth, chip slicing and sorting, component packaging and final assembly ensure the highest quality and attention to our customer's needs.

Advanced sensing solutions can also include both the emission and detection functions within a single package or multiple die array. It all starts with our in house technical staff and engineering prototyping lab to put together the details of the application. The following are examples of industries we have served with our designs:
  •     Medical
  •     Military / Aerospace
  •     Automotive
  •     Machine Vision
  •     Security
  •     Industrial Line Equipment
  •     Linear and Rotary Encoder
Please contact the technical staff at Marktech to discuss your project needs.

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