Bond-Ply 450

Bond-Ply 450 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape. The tape is exclusively available pre-applied to Bergquist T-Clad circuits and features a back side release liner. Bond-Ply 450 is designed to withstand the high temperatures associated with solder reflow without degradation of adhesion or liner release characteristics.The material is designed to attain high bond strength to a variety of “low energy” surfaces, including aluminum heat sinks and many plastics, while maintaining high bond strength with long term exposure to heat and high humidity..

Typical Applications Include

Secure:
  •     Bergquist manufactured LED T-Clad circuits for architectural, automotive, medical, military, signage, signal, transportation, security, aircraft, portable and theatrical lighting
  •     Bergquist manufactured IMS “Power Rails” to heat sink
  •     Bergquist manufactured IMS custom circuits mounted to heat sinks and enclosures
Features:
  •     Thermal performance:
  •     0.87°C-in2/W (@50 psi)
  •     Pre-applied and exclusively available
  •     on Bergquist T-Clad
  •     Eliminates future adhesive assembly
  •     requirements
  •     Withstands reflow processing

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