Nextreme Pumps Up with New OptoCooler High Voltage Series

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the availability of the OptoCooler HV series, a new class of RoHS-compliant high voltage and high heat pumping thermoelectric coolers that are optimized for standard circuitry and power requirements. The first module in the series, the OptoCooler HV14, is the latest product in Nextreme's OptoCooler™ family of thermoelectric coolers designed specifically for the optoelectronics and telecommunications industry.

The OptoCooler HV14 operates at a maximum voltage of 2.9V and can pump 1.7 watts of heat at 85°C in a footprint of only 2.8 mm2. The module can create a temperature differential (T) of up to 51°C between its hot and cold sides, making it ideally suited for the cooling and temperature control of optoelectronic devices such as laser diodes and high brightness LEDs.

At the core of the OptoCooler module is Nextreme's breakthrough Thermal Copper Pillar Bump, an electronic device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular, copper pillar solder bumps) used in electronic and optoelectronic packaging. Thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or other electrical component. Based on market demand and recent technology advances, Nextreme has reduced the size of the thermal bump by 75%, thereby increasing voltages by 300% and reducing current draw by the same proportion. The net result eliminates the need for special voltage conditioning and reduces the overall electrical current required to operate the device.

The new platform uses an array-based assembly (ABA) process that represents a vast improvement in throughput capability and manufacturing tolerances. The ABA process decreases the size of Nextreme’s thermal bumps to approximately 125 microns, which makes them flip-chip bumping compatible with standard solder bumping processes commonly used in electronics packaging. Consequently, as product volumes scale, manufacturers of LEDs and other semiconductor chips can integrate cooling and temperature control functionality directly in the package during assembly, resulting in a high-volume, low cost thermal management solution.

"The new HV Series removes unique voltage and current requirements as barriers to the integration of thin-film thermoelectrics into electronics," said Dave Koester, Vice President of Engineering for Nextreme. "The standard voltages and current operating ranges of the new OptoCooler HV14 fit well within the typical power design criteria for optoelectronic components and systems."

The OptoCooler HV14 is RoHS compliant and is available for order now. Pricing is available upon request.

Comments

Post a Comment

Popular posts from this blog

Biasi Develops ActivA Unique Boiler Range Biasi UK has developed ActivA, a new range of high efficiency A rated condensing boilers boasting a unique heat exchanger. The launch of ActivA is further testimony to the company's commitment to strengthen its position in the UK domestic gas boiler market. At the heart of ActivA is a newly developed pre-mix condensing heat exchanger that is manufactured in a corrosion resistant, pressure moulded aluminium. Its sectional construction means it can be easily adjusted for different boiler outputs and its 'multipass' design ensures very low resistance for both combustion and water passage. This unique heat exchanger carries a five year guarantee. Designed to provide outstanding heating performance at an affordable price for almost all types of domestic properties, the compact range boasts some of the smallest boilers available - at just 700mm high x 400 wide and only 290mm deep - thereby allowing installation in cupboards. As well a
Read more

Han® HC 250 high current contact

A Powerful Solution HARTING has developed the new Han® HC 250high current connector as a powerful interface that impresses by requiring little space, transmitting high current intensities and allowing flexible configuration of the number of poles. The HC 250 one-pole crimp module can be connected in various frame geometries to produce the required number of poles in a compact space – and in the existing Han® HPR housing. Technical details: - Rated current 250 A at a rated voltage of 2000 V - Termination cross-sections are: 35 mm2, 50 mm2 and 70 mm2 - Maximum four-pole interfaces in a size 24 B HPR housing, making it particularly suitable for motor connections - High quality plastic with good smoke and inflammability levels - Removal tool for simple installation and removal of the contacts and inserts - Confusion of a number of interfaces is reliably prevented by multiple coding options for the individual inserts The requirements in the railway industry are changing, as
Read more

HAZARDOUS AREAS - Comparisons Between Standards

Image
The following tables and comments are an attempt to cross reference between different National standards for Hazardous Location Definitions. We note that there is a world wide trend towards IEC standards in the electrical industry and that even the American manufacturers are gearing up to produce products to IEC standards in IEC metric dimensions. COMPARISON OF ZONES FOR ELECTRICAL EQUIPMENT IEC/CENELEC/U.K. GERMANY/JAPAN U.S.A. ZONE 0 DIVISION 1 ZONE 1 DIVISION 1 ZONE 2 DIVISION 2 COMPARISON OF CLASS II CLASSIFICATIONS - DUSTS B.S.6467 & A.S. 2236 -CLASS II U.S.A.-CLASS II DIP - NO SUB - GROUP GROUP E - METAL DUSTS GROUP F - COAL DUSTS GROUP G - GRAIN DUSTS COMPARISON OF GAS GROUPINGS FOR ELECTRICAL EQUIPMENT IEC CENELEC AUSTRALIA U.KBS4683 GERMANY & JAPAN VDEO171 RIIS-TR-TR-79-1 U.S.A. NATIONAL ELECTRIC CODE Representative Gases II IIA II IIA 1 D Propane IIB IIB 2 C Ethylene IIB IIC 3n 3a B Hydrogen IIB 3b
Read more